For over 40 years at STMicroelectronics, ST has been developing a wide portfolio of radiation hardened products qualified to ESCC and QML standards.
ST is recognized for our product quality and reliability, their flexible service options, and our longevity commitment for the supply of legacy products.
From their earliest involvement in space, our semiconductor and package technologies have flown in the majority of space crafts and missions, including the James Webb Space telescope and Artemis moon exploration program.
Recent upgrades to their ESCC and DLA Space certified assembly facility ensure the highest process quality, sophistication, and capacity for their traditional range of space discrete, logic, interface, analog, and power management products.
Regarding new space, ST is currently releasing a new series of rad-hard companion chips in plastic packages for LEO constellations and enabling a new generation of GEO VHTS software-defined communications satellites through technologies and extended foundry services that draw from their space and hardening expertise, our most advanced differentiated mixed signal and RF technologies, and major experience in other high-performance industries such as automotive.
ST completes its foundry services with a fully European supply chain for ASIC customers or fabless companies, offering the most recent packaging technologies covering high-pin-count wire-bonded or flip-chip packages on ceramic or organic substrates from their upgraded space assembly facility.